Xiaomi Mi 11 concept render has surfaced on the web about the design of the company’s next-generation flagship. The render shows both the front and back of the Mi series smartphones. Earlier this week, Xiaomi co-founder and CEO Lei Jun confirmed the Mi 11’s existence at the Qualcomm Snapdragon Tech Summit 2020 by highlighting that the phone will be among the first to come with the Snapdragon 888 SoC. The Mi 11 is expected to come with the Mi 11 Pro.
Concept designer Ben Geskin tweeted the Xiaomi Mi 11 render based on a recent leak. It suggests a triple rear camera with an LED flash and a curved display – with the curvature visible on all sides.
Here's what the Xiaomi #Mi11 might look like 👀
What do you think?
(concept based on leaks) pic.twitter.com/PhpECb7R6F
— Ben Geskin 📸📱👨💻 (@BenGeskin) December 3, 2020
The Mi 11 render also featured a hole-punch display design, with a single selfie camera at the front.
Some live images related to Mi 11 were revealed earlier this week on Weibo. Those images showed the same design as Geskin’s render. One of the leaked photos also suggested an infrared (IR) blaster on the new Mi smartphone.
Xiaomi Mi 11 specifications (required)
Xiaomi Mi 11 is working and will come with Snapdragon 888 SoC as confirmed by Lei Jun. Apart from the chipset, the phone is rumored to have a QHD + display as well as a 120Hz refresh rate. It is also likely to have a 108-megapixel primary camera sensor at the back. Other specifications of the Mi 11 will include at least 8GB of RAM, 128GB of onboard storage, a 20-megapixel selfie camera and a 4,780mAh battery with 50W wired and 30W wireless charging according to some recent details posted on Weibo.