Qualcomm closed the first day of its annual Tech Summit in Maui, Hawaii with the announcement of three new smartphone chipsets. The first is the Snapdragon 865 flagship SoC, which makes the Snapdragon 855 and 855+ chipsets a success. The new chip supports the X55 5G modem launched earlier this year but is not integrated with it. Additionally, it claims better AI performance and up to 25 percent increase in graphics capabilities. The new chip will be seen in flagship smartphones early next year, including partners such as Oppo, Xiaomi, ZTE and more.
The Snapdragon 765 and Snapdragon 765G were the other two chips announced, and are probably the most interesting offering as they feature an integrated 5G modem, and will appear in more affordable phones. HMD Global will be one of the first companies to launch a new phone early next year, based on the Snapdragon 765 mobile platform.
Qualcomm is yet to share a lot of details about these new chipsets, as it plans to reveal them over the next two days. The Snapdragon 865 SoC, which was announced today, will have an improved AI engine capable of 15TOPS (trillion operations per second), which Qualcomm says is more than double the Snapdragon 855. The new ISP is also said to be capable of shooting. 8K video at 30fps and 8K video decoding at 60fps. Meanwhile, the Snapdragon 765 and 765G are also said to offer capabilities such as HDR10 4K video recording and support for up to 192-megapixel camera sensors.
Qualcomm announced its next generation ultrasonic fingerprint sensor technology, called 3D Sonic Max. It is said to offer a recognition area that is 17 times larger than the previous generation and supports for two-finger authentication simultaneously.