Apple is reportedly planning to use Qualcomm’s ultrasonic fingerprint sensor technology in an iPhone model, to be released in 2020. The iPhone maker was partnering with Taiwanese touchscreen manufacturer GIS to develop an iPhone for 2020 or 2021 that could use under-display technology, MacRumors reported on Wednesday. Qualcomm on Tuesday unveiled the new 3D Sonic Max ultrasonic fingerprint reader at its third annual Snapdragon Technology Summit.
Qualcomm supplies ultrasonic fingerprint sensors for Samsung’s Galaxy S10 and Galaxy Note 10 smartphones. But iPhones may use an even more advanced version of the technology by 2020 or in the 2021 roll.
JPMorgan analyst Samik Chatterjee believes that Apple will release a 5.4-inch iPhone with 5G connectivity in 2020, two 6.1-inch iPhones and a 6.7-inch iPhone.
Chatterjee predicted that the company had two high-end models (one 6.1-inch and one 6.7-inch) for the mmWave as well as a triple-lens camera and “facing the world” for enhanced augmented reality capabilities. 3 Can present with D sensing.
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Whereas, two low-end models (6.1-inch, 5.4-inch) will not have a 3D sensing facing MMway or World, and will have a dual-lens camera.
Reportedly, Apple can use Qualcomm’s X55 modem in all of its 2020 iPhones, which support both mmWave and sub-6GHz spectrum.
All four iPhone models will be OLED. Apple may use OLED displays from Samsung that are thinner than the displays currently being used.