The Cupertino-based tech giant Apple is reportedly planning to launch its first 5G iPad this year, in addition to the rumored 5G-capable iPhone 12 in September. To that end, Advanced Semiconductor Engineering (ASE), a Taiwanese component company, is reportedly in the supply chain for Apple’s mmWave 5G iPhones and 5G iPads with its substrate-based FC-AiP (flip chip antenna-in-package) technology have broken.
Apple Insider reported the news, citing Taiwanese publication Digitimes, which typically covered supply chain development. Apple hopes to update the iPad Pro in early 2020, but a 5G model may debut in a later year.
Apple viewing analyst Ming-Chi Kuo recently revealed that the iPhone maker hopes to release new iPad Pro models with rear 3D sensing in the first half of 2020.
In a research note with TF International Securities, Kuo stated that the iPad Pro model will achieve 3D sensing through the rear-facing camera system.
Reportedly, Apple is expected to use a time-of-flight system, which measures the time it takes light to bounce objects in a room to create a 3D map.
Additionally, Kuo also reiterated that Apple plans to release its low-cost iPhone SE 2 in the first half of 2020 as well.
The iPhone SE 2 will use a 10-layer substrate-like PCB (SLP) for its motherboard, the same technology used by the iPhone 11 version.